- Other Tools[5]
- Solar Cells[10]
- Solar Energy Systems[10]
- Street Lights[1]
- Garden Lights[1]
- Other Lights & Lighting Products[1]
- Pumps[7]
- Solar Water Heaters[7]
- Solar Controllers[7]
- Servers[1]
- Engineered Flooring[6]
- Contact Person : Mr. Wang Jason
- Company Name : Xiamen Sinodia Electronic Co., Ltd.
- Tel : 0086-592-5333371
- Fax : 0086-592-5334386,5334370 Address: No.1305 PICC Mansion, No.68 North Hubin Road Zip: 361004 Country/Region: China (Mainland) Province/State: Fujian City: XIAMEN
- Address : Fujian,XIAMEN,No.1305 PICC Mansion, No.68 North Hubin Road
- Country/Region : China
- Zip : 361004
0.14mm Micron Diamond Line
Diamond Fast Cutting Wire is a highly anti-drawing steel wire, the outer covered with diamond, and after special treatment, its flexibility is strong, it is not easy for diamonds to drop, and long term for using.
Product Information: Description: Our diamond cutting wire use electroplating principle, diamond coated on a high-tensile steel wire. After special treatment, diamond is not easy to fall off and using life is long.The principle of cutting:The principle of diamond fret saw based on cutting abrasion between the abradant material concreted on the steel wire and the work-piece material, the abradant material do not act on the wire directly, it belongs to one kind of inflexible cutting processing methods.
Features: 1.Saving materialsDiamond cutting crack is small and rate of piece is high, it can reach 90%, saving material greatly.2.Cutting precisionAccuracy of cutting material can be achieved, and the surface is smooth, it can be polished directly after cutting, eliminating the grinding process, saving time and materials.3.Cutting speedDiamond cutting wire cutting speed is faster, greatly improving the work efficiency.4.No collapseWhile cutting a variety of hard and brittle material, collapsing edges are less than 10mm, can be avoided easily give rise to the inner circle cutting edge or the bottom of the crack.5.Reduce environmental pollutionCutting by water cutting, can prevent pieces of powder pollution and maintain the working environment of materials and equipment clean.
Product Specifications:Dia.(mm) Tolerance(mm) Breaking force(N) Object to cut 0.12 0.005 ≥25 Silicon slice 0.14 0.005 ≥30 Silicon/Magnetic Material/Gem Slice 0.26 0.020 ≥70 Silicon/Magnetic Material/Gem/Jade/Crystal/Glass/Ceramic 0.3 0.03 ≥100 Silicon/Magnetic Material/Gem/Jade/Crystal/Glass/Ceramic 0.35 0.03 ≥140 Silicon/Magnetic Material/Gem/Jade/Crystal/Glass/Ceramic 0.38 0.03 ≥150 Silicon/Magnetic Material/Gem/Jade/Crystal/Glass/Ceramic 0.4 0.04 ≥190 Silicon/Magnetic Material/Gem/Jade/Crystal/Glass/CeramicNotes: The above length and diameter can be customized according to the customers’requirements.
0.14mm Micron Diamond Line
